A cikin tsari naPCBmasana'antu, samar da aKarfe Stencil (kuma aka sani da "stencil")Ana aiwatar da shi don yin daidai da manna solder akan abin da ake solder manna na PCB.Layer manna mai siyar, wanda kuma ake magana da shi a matsayin "manna abin rufe fuska," wani yanki ne na fayil ɗin ƙirar PCB da ake amfani da shi don ayyana matsayi da sifofinsolder manna.Ana iya ganin wannan Layer kafinFasahar Haɗaɗɗiya (SMT)Ana siyar da kayan aikin akan PCB, yana nuna inda ake buƙatar sanya manna mai siyarwa.A lokacin aikin siyar da siyar, stencil na ƙarfe yana rufe Layer manna mai siyar, kuma ana amfani da manna solder daidai akan pads ɗin PCB ta cikin ramukan da ke kan stencil, yana tabbatar da ingantacciyar siyarwar yayin aiwatar da haɗakar abubuwan da ke gaba.
Sabili da haka, Layer manna mai siyar wani muhimmin abu ne wajen samar da stencil na karfe.A farkon matakan masana'anta na PCB, ana aika bayanin game da abin da aka yi da yumɓun manna zuwa ga masana'anta na PCB, wanda ke haifar da stencil ɗin ƙarfe daidai don tabbatar da daidaito da amincin tsarin siyarwar.
A cikin ƙirar PCB (Printed Circuit Board), "Pastemask" (wanda kuma aka sani da "mask ɗin manna" ko kuma kawai "mask ɗin solder") wani abu ne mai mahimmanci.Yana taka muhimmiyar rawa a cikin tsarin sayar da kayayyaki don haɗawaNa'urorin hawan saman (SMDs).
Ayyukan stencil na karfe shine don hana manna solder shafa wa wuraren da ba za a iya yin siyar da kayan aikin SMD ba.Manna solder shine kayan da ake amfani dashi don haɗa abubuwan SMD zuwa gammaye na PCB, kuma Layer ɗin pastemask yana aiki azaman "shamaki" don tabbatar da cewa ana amfani da manna solder kawai ga takamaiman wuraren siyarwa.
Zane-zanen Layer na pastemask yana da matuƙar mahimmanci a cikin tsarin masana'anta na PCB saboda kai tsaye yana rinjayar ingancin siyarwar da aikin gabaɗaya na abubuwan SMD.A lokacin zane na PCB, masu zanen kaya suna buƙatar yin la'akari da tsarin shimfidar mashin pastemask a hankali, tare da tabbatar da daidaita shi tare da sauran yadudduka, kamar Layer pad da Layer Layer, don tabbatar da daidaito da amincin tsarin siyarwar.
Ƙirƙirar Ƙira don Solder Mask Layer (Steel Stencil) a cikin PCB:
A cikin ƙira da ƙira na PCB, ƙayyadaddun ƙayyadaddun tsari don Solder Mask Layer (wanda kuma aka sani da Karfe Stencil) galibi ana bayyana su ta ma'aunin masana'antu da buƙatun masana'anta.Anan ga wasu ƙayyadaddun ƙira na gama gari don Solder Mask Layer:
1. IPC-SM-840C: Wannan shine ma'aunin Solder Mask Layer wanda IPC (Association Connecting Electronics Industries) ya kafa.Ma'auni yana zayyana ayyuka, halaye na jiki, dorewa, kauri, da buƙatun solderability don abin rufe fuska.
2. Launi da Nau'in: Mashin solder na iya zuwa iri daban-daban, kamarMatsayin Solder Air Hot Air (HASL) or Nickel Immersion Zinariya maras Wutar Lantarki(ENIG), kuma nau'ikan iri daban-daban na iya samun buƙatun takamaiman takamaiman.
3. Rufin Solder Mask Layer: Ya kamata Layer abin rufe fuska ya rufe duk wuraren da ke buƙatar siyar da kayan aikin, tare da tabbatar da ingantaccen garkuwar wuraren da bai kamata a sayar da su ba.Har ila yau, Layer abin rufe fuska ya kamata ya guje wa rufe wuraren da ake hawa kayan abu ko alamar siliki.
4. Tsallakewar Solder Mask Layer: Ya kamata Layer abin rufe fuska ya kasance yana da tsafta mai kyau don tabbatar da bayyanannun ganuwa na gefuna na pads na solder da kuma hana manna solder daga ambaliya zuwa wuraren da ba a so.
5. Kauri na Solder Mask Layer: Ya kamata kauri na solder mask Layer ya bi daidaitattun buƙatun, yawanci a cikin kewayon dubun na mitoci da yawa.
6. Kaucewa Pin: Wasu na musamman aka gyara ko fil na iya buƙatar zama fallasa a cikin abin rufe fuska na solder don saduwa da takamaiman buƙatun siyarwa.A irin waɗannan lokuta, ƙayyadaddun abin rufe fuska na solder na iya buƙatar guje wa aikace-aikacen abin rufe fuska a waɗannan takamaiman wuraren.
Yin biyayya da waɗannan ƙayyadaddun bayanai yana da mahimmanci don tabbatar da inganci da daidaito na Layer mask ɗin solder, don haka inganta ƙimar nasara da amincin masana'antar PCB.Bugu da ƙari, bin waɗannan ƙayyadaddun bayanai yana taimakawa haɓaka aikin PCB kuma yana tabbatar da daidaitaccen haɗuwa da siyar da abubuwan SMD.Haɗin kai tare da masana'anta da bin ƙa'idodin da suka dace yayin tsarin ƙira wani mataki ne mai mahimmanci don tabbatar da ingancin layin stencil na ƙarfe.
Lokacin aikawa: Agusta-04-2023
